Note: SPD
reading is blocked on some Asustek motherboard models.
Memory Slot N
Information about memory module in slot number N
Memory Type: Memory module
features - size, speed (PC66, PC100, PC133 for SDRAM; PC1600,
PC2100, PC2700, PC3200 for DDR SDRAM), memory usage type (SDRAM,
DDR SDRAM, DDR SGRAM, DDR2 SDRAM, DDR3 SDRAM, RDRAM, EDO, DDR4
SDRAM).
Manufacturer: Memory module
manufacturer. If module memory manufacturer is unknown (memory was
made in China) the program will identify it as "Noname".
DRAM Manufacturer: DRAM
chips manufacturer. Only for DDR4+.
Module Type: Memory module
type (DIMM, SO-DIMM, RIMM, SO-RIMM).
Number of
Rows/Banks: Only for SDRAM.
Number of
Ranks/Banks:
Module Attributes: Possible
values: 'Unbuffered', 'Buffered', 'Registered, Unbuffered',
'Registered, Buffered'. Only for SDRAM and DDR memory.
Error Checking: Memory
module error checking. None - absent, Parity - parity check, ECC -
error correction (in brackets error correction module discharge).
Only for SDRAM and DDR memory.
JEDEC Timings : JEDEC
timings in format: JEDEC Profile @ Frequency -
CL-tRCD-tRP-tRAS-tWR-tRC-tRFC1-tRFC2-tRFC4 (Active).
RAMBUS Timings : RAMBUS
timings in format: RAMBUS Profile @ Frequency -
CL-tCLS-tRCD-tRP-tRAS-tRR-tPP.
CL: CAS Latency. The time between sending a column
address to the memory and the beginning of the data in response.
tCLS: CLS
Latency (Only for RDRAM). tRCD: Row Address (RAS) to Column Address
(CAS) Delay. tRP: Row Precharge
Time. tRAS: Row Active Time.
tRR: Minimum RAS-to-RAS Time (Only for RDRAM).
tPP: Minimum
Precharge-to-Precharge Time (Only for
RDRAM).
tWR: Write
Recovery Time (Only for DDR2, DDR3). tRC: Row Cycle Time. tRFC1, tRFC2, tRFC4: Refresh
Cycle Time (Only for DDR4). Frequency: maximum frequency in MHz for these
profile. Active: This profile is used by BIOS to
program the memory
controller.
CS# Latency: CS# Latency
(Only for DDR1).
WE# Latency: WE# Latency
(Only for DDR1).
Refresh Rate: Memory module
refresh rate.
Data Width: External bus
data width.
SDRAM Width: Memory module
organization. Only for SDRAM, DDR.
Voltage Interface: Memory
module voltage interface.
Max Case Temperature:
Maximum case temperature.
Protocol Version: Current
RDDRAM protocol version. Only for RDDRAM.
SPD Revision: Number of the
using SPD revision.
Part Number: Unique part
number.
Manufacturing Location:
Memory module manufacturing location
Manufacture Date: Memory
module manufacture date.
Serial Number: Unique
module's serial number.
Revision Code: Number of
the module revision code.
HeatSpreader: RIMM has a
heatspreader.
Digital Thermal Sensor:
RIMM have a thermal
sensor.
EPP Support: Enhanced Performance Profiles (EPP)
is supported.
Optimal Profile: The EPP Profile for Optimal
Performance. Specifies which Profile should be loaded to maximize
system performance.
XMP Support: Intel Extreme Memory Profile (XMP)
is supported.
XMP Revision:
EPP Profile N
EPP Profile Type: The EPP
section of the SPD may contain one of two defined profile types:
Full Profile and Abbreviated Profiles.
Voltage Interface: The
voltage level required for this profile.
EPP Timings : EPP timings
in format: EPP Profile @ Frequency - CL-tRCD-tRP-tRAS-tWR-tRC-CR
(Active). See JEDEC Timings for details.
CR: Command Rate. If the
command rate is set to 1T, then commands can be sent on every clock
edge. If the command rate is set to 2T, then commands can be sent
on every other clock edge.
XMP Profile N
Profile Name: Name of XMP
profile.
Voltage Interface: The
voltage level required for this profile.
XMP Timings : XMP timings
in format: XMP Profile @ Frequency - CL-tRCD-tRP-tRAS-tWR-tRC-CR.
See JEDEC Timings for details.
CR: Command Rate. If the
command rate is set to 1T, then commands can be sent on every clock
edge. If the command rate is set to 2T, then commands can be sent
on every other clock edge.
Note: Some
characteristics of Noname memory modules can be identified as
'None', i.e. corresponding information is absent.
